Features:High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.New patented phone X Middle Layer Mother
Features:
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.New patented phone X Middle Layer Motherboard for Phone X Middle layer motherboard.Assisting professionals to do Phone X BGA reballing in the most convenient and safest way.Specification:
Type:A7 CPU/A8 CPU/A9 CPU /A10 CPU /A11 CPUPackage included:
1 xBGA Reballing ToolDetails pictures:
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