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S500 3D BGA Reballing Stencil CPU Module BGA Reballing Repair Tool for Phone 5 5S 6 6S 7G 7Plus 8 8P

$145.00 $521.90

Features:High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.New patented phone X Middle Layer Mother

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Features:

High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.New patented phone X Middle Layer Motherboard for Phone X Middle layer motherboard.Assisting professionals to do Phone X BGA reballing in the most convenient and safest way.Specification:

Type:A7 CPU/A8 CPU/A9 CPU /A10 CPU /A11 CPUPackage included:

1 xBGA Reballing ToolDetails pictures:

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